Snap Inc.

Sep 25, 2026

PCB Design Engineer

United States

Los Angeles, California, United States · Santa Monica, California, United States

About the opportunity

Snap Inc snap.com/en-US/ is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves, live in the moment, learn about the world, and have fun together.

The Company operates Snapchat snapchat.com/?lang=en-US, a visual messaging app that enhances your relationships with friends, family, and the world, and Specs Inc. specs.com/, a wholly-owned subsidiary dedicated to making computing more human, in addition to Bitmoji bitmoji.com/, Saturn, and other digital services.

Specs Inc. is a wholly-owned subsidiary of Snap Inc. dedicated to making computing more human. The company develops Specs, advanced eyewear that seamlessly integrates digital experiences into the physical world.

Specs feature see-through lenses that place digital objects directly into three-dimensional space, powered by Snap OS, a proprietary, context-aware operating system designed for natural interaction with your hands and voice.

Specs Inc. also provides Lens Studio, a full suite of advanced developer tools that powers immersive augmented reality experiences across Specs, Snapchat, and other services.

Snap’s camera supports real friendships through visual communication, self expression and storytelling. Moving forward, our camera will play a transformative role in how people experience the world around them, combining what they see in the real world, with all that’s available to them in the digital world.

We’re looking for a Senior PCB Designer to join the Spectacles team at Snap Inc!

What you’ll do

Work closely with electrical, mechanical, and manufacturing engineers to produce industry leading flexes and printed circuit board (PCB) designs from prototype through mass production using Allegro PCB Designer.

Design high density PCBs, flexes, and rigid flexes requiring the use of stacked microvias, sequential lamination stack-ups, and fine pitch packages.

Create fabrication and assembly drawings.

Define design rules, apply them to the constraint manager, design within limits, create artworks, fabrication and assembly documentation, and verify designs prior to release.

Collaborate with suppliers on stackups, capabilities, and solving engineering issues.

Manage external ECAD resources as needed.

Review Gerber/ODB++ data to ensure quality of design release.

Drive simultaneous development of multiple challenging, complex PCB designs to meet critical program deadlines.

Minimum requirements

Knowledge, Skills & Abilities

Ability to communicate effectively in both oral and written form.

Ability to understand and follow instructions.

Skill in using logic and reasoning to identify the strengths and weaknesses of alternative solutions, conclusions, or approaches to problems.

Skill in completing assignments accurately and with attention to detail.

Ability to work under pressure and meet close deadlines.

Ability to analyze, organize and prioritize work while meeting multiple deadlines.

Ability to collaborate and operate in a fast-paced cross-functional environment including engineering teams, vendors, suppliers, and outside resource management.

Minimum Qualifications

7+ years of post-Bachelor’s in Electrical Engineering or related degree experience in; PCB Layout CAD tools to design high density, highly constrained HDI boards with fine pitch (<0.5mm) BGAs, or Master’s degree in a technical field + 6+ years of post-grad experience; or PhD in a relevant technical field + 3+ years of post-grad experience.

Preferred Qualifications

Experience developing consumer electronic devices at production scale

Experience routing impedance controlled nets, including differential pairs, per engineer’s instructions and component specifications.

Strong skills in designing quality multi-layer, high density designs with careful consideration of analog, RF, high speed, and/or power circuits.

Demonstrated understanding of IPC, Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Testability (DFT)

Knowledge of PCB design standards for common interfaces in consumer products such as USB, PCIE, CSI, MIPI, and WIFI.

Experience with best practices for system integration and layout verification including mating of multiple boards (pin 1 verification methods, system level high speed length matching) and mechanical interference checks.

Experience with one or more of the following: Flex & Rigid Flex Designs, Cadence Allegro, ORCAD Capture, CIS/CIP, CAM350, and/or Valor toolsets, PCB ECAD Library creation and management, and/or script/automation creation.

"Default Together" Policy at Snap: At Snap Inc. we believe that being together in person helps us build our culture faster, reinforce our values, and serve our community, customers and partners better through dynamic collaboration. To reflect this, we practice a “default together” approach and expect our team members to work in an office 4+ days per week.

At Snap, we believe that having a team of diverse backgrounds and voices working together will enable us to create innovative products that improve the way people live and communicate. Snap is proud to be an equal opportunity employer, and committed to providing employment opportunities regardless of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex, gender, gender identity, gender expression, pregnancy, childbirth and breastfeeding, age, sexual orientation, military or veteran status, or any other protected classification, in accordance with applicable federal, state, and local laws.

EOE, including disability/vets.

We are an Equal Opportunity Employer and will consider qualified applicants with criminal histories in a manner consistent with applicable law (by example, the requirements of the San Francisco Fair Chance Ordinance and the Los Angeles Fair Chance Initiative for Hiring, where applicable).

Compensation

In the United States, work locations are assigned a pay zone which determines the salary range for the position. The successful candidate’s starting pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions. The starting pay may be negotiable within the salary range for the position. These pay zones may be modified in the future.

Zone A (CA, WA, NYC) careers.snap.com/us-payzones: The base salary range for this position is $190,000-$284,000 annually.

Zone B careers.snap.com/us-payzones: The base salary range for this position is $181,000-$270,000 annually.

Zone C careers.snap.com/us-payzones: The base salary range for this position is $162,000-$241,000 annually.

If you believe this job description is missing required pay transparency information, please submit a report through this form: Job Description Pay Range Disclosure docs.google.com/forms/d/e/1FAIpQLSdOEWxjdfgw_nPe4q7ktiLTG4paeYR5SZAfSVwSROnDlTXisA/viewform.

Our Benefits careers.snap.com/benefits

Snap Inc. is its own community, so we’ve got your back! We do our best to make sure you and your loved ones have everything you need to be happy and healthy, on your own terms. Our benefits are built around your needs and include paid parental leave, comprehensive medical coverage, emotional and mental health support programs, and compensation packages that let you share in Snap’s long-term success!

This position is eligible for equity in the form of RSUs.

Languages

PCB Design Engineer

About the opportunity

What you’ll do

Minimum requirements

Knowledge, Skills & Abilities

Minimum Qualifications

Preferred Qualifications

Compensation

Our Benefits careers.snap.com/benefits

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